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Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common.
If wire connections is the method of choice to form these connections, thermosonic bonding gold wires directly to the silicon chip has been the process most widely used because of its proven reliability as a result of the low bonding parameters of force, temperature, and time needed to form the bond.
Processing a flip chip is similar to conventional IC fabrication, with a few additional steps. [6] Near the end of the manufacturing process, the attachment pads are metalized to make them more receptive to solder. This typically consists of several treatments. A small dot of solder is then deposited on each metalized pad.
The following operations are performed at the packaging stage, as broken down into bonding, encapsulation, and wafer bonding steps. Note that this list is not all-inclusive and not all of these operations are performed for every package, as the process is highly dependent on the package type. IC bonding. Wire bonding; Thermosonic Bonding; Down ...
Glob-top is a variant of conformal coating used in chip-on-board assembly (COB). It consists of a drop of specially formulated epoxy [4] or resin deposited over a semiconductor chip and its wire bonds, to provide mechanical support and exclude contaminants such as fingerprint residues which could disrupt circuit operation. It is most commonly ...
Chip-size package (CSP) developed by National Semiconductor [21] COB: Chip on board: Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. [22] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a ...
This is the so-called ball bond that gives the process its name. [2] (All-aluminum systems in semiconductor fabrication eliminate the "purple plague"—a brittle gold-aluminum intermetallic compound—sometimes associated with pure gold bonding wire. This property makes aluminum ideal for ultrasonic bonding.)
Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is commonly used in the semiconductor industry . Wedge bonding is directional, so the bonding head rotates to accommodate the different angles for bonding.
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