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An IBM circuit board from a NASA Space Shuttle computer with a conformal coating applied. Conformal coating is a protective, breathable coating of thin polymeric film applied to printed circuit boards (PCBs). Conformal coatings are typically applied with 25–250 μm [1] thickness on electronic circuitry to protect against moisture and other ...
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of package types exist.
With technological advancement deposits up to .025" have been achieved and retained uniformity. Disadvantages compared to tank plating can include greater operator involvement (tank plating can frequently be done with minimal attention and the solutions used are often toxic), and the inconsistency in achieving as great a plate thickness.
The size and shape of the metal particles in the solder paste determines how well the paste will "print". A solder ball is spherical in shape; this helps in reducing surface oxidation and ensures good joint formation with the adjoining particles. Irregular particle sizes are not used, as they tend to clog the stencil, causing printing defects.
PCB via current capacity chart showing 1 mil plating via current capacity & resistance versus diameter on a 1.6 mm PCB. In printed circuit board (PCB) design, a via consists of two pads in corresponding positions on different copper layers of the board, that are electrically connected by a hole through the board.
There are numerous steps in thick film manufacturing which need careful control, like roughness of the substrate, curing temperatures and times of pastes, selected stencil thickness vs. paste type, etc., [10] [11] Therefore the number of pastes used and process steps define the complexity of the process and cost of the final product.
Immersion silver plating (or IAg plating) is a surface plating process that creates a thin layer of silver over copper objects. It consists in dipping the object briefly into a solution containing silver ions.