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Unless stated otherwise, the properties of fused silica (quartz glass) and germania glass are derived from the SciGlass glass database by forming the arithmetic mean of all the experimental values from different authors (in general more than 10 independent sources for quartz glass and T g of germanium oxide glass). The list is not exhaustive.
Ultra-high-temperature ceramics (UHTCs) are a type of refractory ceramics that can withstand extremely high temperatures without degrading, often above 2,000 °C. [1] They also often have high thermal conductivities and are highly resistant to thermal shock, meaning they can withstand sudden and extreme changes in temperature without cracking or breaking.
In the last column, major departures of solids at standard temperatures from the Dulong–Petit law value of 3 R, are usually due to low atomic weight plus high bond strength (as in diamond) causing some vibration modes to have too much energy to be available to store thermal energy at the measured temperature.
Solid-state chemistry reveals the fundamental connection between microstructure and properties, such as localized density variations, grain size distribution, type of porosity, and second-phase content, which can all be correlated with ceramic properties such as mechanical strength σ by the Hall-Petch equation, hardness, toughness, dielectric ...
A high strength glass-ceramic cook-top with negligible thermal expansion. Glass-ceramic materials share many properties with both glasses and ceramics. Glass-ceramics have an amorphous phase and one or more crystalline phases and are produced by a so-called "controlled crystallization", which is typically avoided in glass manufacturing.
Glass databases are a collection of glass compositions, glass properties, glass models, associated trademark names, patents etc. These data were collected from publications in scientific papers and patents, from personal communication with scientists and engineers, and other relevant sources.
Ultra low expansion glass has an coefficient of thermal expansion of about 10 −8 /K at 5–35 °C. [2] It has a thermal conductivity of 1.31 W/(m·°C), thermal diffusion of 0.0079 cm 2 /s, a mean specific heat of 767 J/(kg·°C), a strain point of 890 °C [1634 °F], and an estimated softening point of 1490 °C [2714 °F], an annealing point ...
As quoted from various sources in an online version of: David R. Lide (ed), CRC Handbook of Chemistry and Physics, 84th Edition.CRC Press. Boca Raton, Florida, 2003; Section 12, Properties of Solids; Thermal and Physical Properties of Pure Metals / Thermal Conductivity of Crystalline Dielectrics / Thermal Conductivity of Metals and Semiconductors as a Function of Temperature