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In time management, gold plating is the phenomenon of working on a project or task past the point of diminishing returns.. For example, after having met a project's requirements, the manager or the developer works on further enhancing the product, thinking that the customer will be delighted to see additional or more polished features, beyond that which what was asked for or expected.
The thickness of gold plating on jewellery is noted in microns (or micro-meters). The microns of thickness determines how long the gold plating lasts with usage. The jewellery industry denotes different qualities of gold plating in the following terminology Gold flashed / Gold washed - gold layer thickness less than 0.5 micron
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for ...
Initially, a special plating deposit called a strike or flash may be used to form a very thin (typically less than 0.1 μm thick) plating with high quality and good adherence to the substrate. This serves as a foundation for subsequent plating processes.
Black nickel plating was developed around 1905, and between the two wars, black chrome plating (first German patent 1929.GP 607, 420), which saw wider use only from the mid-1950s. [14] After the First World War, the first procedures for anodic oxidation and coloring of anodically oxidized aluminium were developed (1923, 1924.DRP. 413876).
16th century cupellation furnaces (per Agricola). Cupellation is a refining process in metallurgy in which ores or alloyed metals are treated under very high temperatures and subjected to controlled operations to separate noble metals, like gold and silver, from base metals, like lead, copper, zinc, arsenic, antimony, or bismuth, present in the ore.
The process was invented in 1874 by Emil Wohlwill. This electrochemical process involves using a cast gold ingot, often called a doré bar, of 95%+ gold to serve as an anode. Lower percentages of gold in the anode will interfere with the reaction, especially when the contaminating metal is silver or one of the platinum group elements.