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Soldering (US: / ˈ s ɒ d ər ɪ ŋ /; UK: / ˈ s oʊ l d ər ɪ ŋ /) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint.
Solder used in making electrical connections also needs to have favorable electrical characteristics. Soft solder typically has a melting point range of 90 to 450 °C (190 to 840 °F; 360 to 720 K), [3] and is commonly used in electronics, plumbing, and sheet metal work.
Electric soldering iron A gas-fired soldering iron. A soldering iron is a hand tool used in soldering. It supplies heat to melt solder so that it can flow into the joint between two workpieces. A soldering iron is composed of a heated metal tip (the bit) and an insulated handle.
Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ...
Soldering a printed circuit board Soldering is a joining process that occurs at temperatures below 450 °C (842 °F). It is similar to brazing in the way that a filler is melted and drawn into a capillary to form a joint, although at a lower temperature.
Selective soldering machine. Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes. This usually follows an SMT oven ...
Ultrasonic soldering iron tips can heat (up to 450 °C) while mechanically oscillating at 20—60 kHz. This soldering tip can melt solder filler metals as acoustic vibrations are induced in the molten solder pool. The vibration and cavitation in the molten solder then permits solders to wet and adhere to many metal surfaces.
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]