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Ivy Bridge is the codename for Intel's 22 nm microarchitecture used in the third generation of the Intel Core processors (Core i7, i5, i3). Ivy Bridge is a die shrink to 22 nm process based on FinFET ("3D") Tri-Gate transistors, from the former generation's 32 nm Sandy Bridge microarchitecture—also known as tick–tock model.
32 nm microarchitecture, released January 9, 2011. Formerly called Gesher but renamed in 2007. [2] First x86 to introduce 256 bit AVX instruction set and implementation of YMM registers. Ivy Bridge: successor to Sandy Bridge, using 22 nm process, released in April 2012. Haswell 22 nm microarchitecture, released June 3, 2013.
On September 22, 2009, during the Intel Developer Forum Fall 2009, Intel showed a 22 nm wafer and announced that chips with 22 nm technology would be available in the second half of 2011. [9] SRAM cell size is said to be 0.092 μm 2, smallest reported to date. On January 3, 2010, Intel and Micron Technology announced the first in a family of 25 ...
Intel Launches Low-Power, High-Performance Silvermont Microarchitecture NEWS HIGHLIGHTS: Intel announces Silvermont microarchitecture, a new design in Intel's 22nm Tri-Gate SoC process delivering ...
The latest badge promoting the Intel Core branding. The following is a list of Intel Core processors.This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors.
Silvermont is the successor of the Bonnell, using a newer 22 nm process (previously introduced with Ivy Bridge) and a new microarchitecture, replacing Hyper Threading with out-of-order execution. [ 2 ]
Intel Core i7 and Intel Core i5 processors based on Intel's Ivy Bridge 22 nm technology for series 7 chip-sets went on sale worldwide on April 23, 2012. [ 115 ] Chips using 20 nm technology
Tick–tock was a production model adopted in 2007 by chip manufacturer Intel.Under this model, every new process technology was first used to manufacture a die shrink of a proven microarchitecture (tick), followed by a new microarchitecture on the now-proven process (tock).