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The SI unit for heat capacity of an object is joule per kelvin (J/K or J⋅K −1). Since an increment of temperature of one degree Celsius is the same as an increment of one kelvin, that is the same unit as J/°C. The heat capacity of an object is an amount of energy divided by a temperature change, which has the dimension L 2 ⋅M⋅T −2 ...
Table of specific heat capacities at 25 °C (298 K) unless otherwise noted. [citation needed] Notable minima and maxima are shown in maroon. Substance Phase Isobaric mass heat capacity c P J⋅g −1 ⋅K −1 Molar heat capacity, C P,m and C V,m J⋅mol −1 ⋅K −1 Isobaric volumetric heat capacity C P,v J⋅cm −3 ⋅K −1 Isochoric ...
The term specific heat may also refer to the ratio between the specific heat capacities of a substance at a given temperature and of a reference substance at a reference temperature, such as water at 15 °C; [5] much in the fashion of specific gravity. Specific heat capacity is also related to other intensive measures of heat capacity with ...
Since the molar heat capacity of a substance is the specific heat c times the molar mass of the substance M/N its numerical value is generally smaller than that of the specific heat. Paraffin wax , for example, has a specific heat of about 2500 J⋅K −1 ⋅kg −1 but a molar heat capacity of about 600 J⋅K −1 ⋅mol −1 .
In thermal physics and thermodynamics, the heat capacity ratio, also known as the adiabatic index, the ratio of specific heats, or Laplace's coefficient, is the ratio of the heat capacity at constant pressure (C P) to heat capacity at constant volume (C V).
The SI unit of volumetric heat capacity is joule per kelvin per cubic meter, J⋅K −1 ⋅m −3. The volumetric heat capacity can also be expressed as the specific heat capacity (heat capacity per unit of mass, in J⋅K −1 ⋅kg −1) times the density of the substance (in kg/L, or g/mL). [1] It is defined to serve as an intensive property.
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).
The laws of thermodynamics imply the following relations between these two heat capacities (Gaskell 2003:23): = = Here is the thermal expansion coefficient: = is the isothermal compressibility (the inverse of the bulk modulus):
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