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  2. RoHS - Wikipedia

    en.wikipedia.org/wiki/Lead_free

    The more common lead-free solder systems have a higher melting point, e.g. a 30 °C typical difference for tin-silver-copper alloys, but wave soldering temperatures are approximately the same at ~255 °C; [47] however at this temperature most typical lead-free solders have longer wetting times than eutectic Pb/Sn 37:63 solder. [49]

  3. Dip soldering - Wikipedia

    en.wikipedia.org/wiki/Dip_soldering

    The most common dip soldering operations use zinc-aluminum and tin-lead solders. Solder pot metal: cast iron or steel, electrically heated. Bath temperature: 220 to 260 °C (for binary tin-lead alloys) or 350 to 400 °C (for lead-free alloys) Solder composition: 60% Sn, 40% Pb or eutectic alloy.

  4. Head-in-pillow defect - Wikipedia

    en.wikipedia.org/wiki/Head-in-pillow_defect

    The defect can be caused by surface oxidation or poor wetting of the solder, or by distortion of the integrated circuit package or circuit board by the heat of the soldering process. This is particularly a concern when using lead-free solder, which requires higher processing temperature.

  5. Whisker (metallurgy) - Wikipedia

    en.wikipedia.org/wiki/Whisker_(metallurgy)

    Following the Restriction of Hazardous Substances Directive (RoHS), the European Union banned the use of lead in most consumer electronic products from 2006 due to health problems associated with lead and the "high-tech trash" problem, leading to a re-focusing on the issue of whisker formation in lead-free solders.

  6. Solderability - Wikipedia

    en.wikipedia.org/wiki/Solderability

    Solderability when using lead-free alloys can differ significantly from solderability when using lead based alloys. Noble metals may be easy to solder but they have brittle joints. The metals in the good category require a large amount of heat therefore oxidation is an issue. To overcome this a flux is required.

  7. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. Sn 62 Pb 37 Cu 1: 183 [17] Pb: Yes: Similar to Sn 63 Pb 37. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. Sn 63 Pb 37 P 0.0015-0.04: 183 ...

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  9. Solder fatigue - Wikipedia

    en.wikipedia.org/wiki/Solder_fatigue

    Historically, tin-lead solders were common alloys used in the electronics industry. Although they are still used in select industries and applications, lead-free solders have become significantly more popular due to RoHS regulatory requirements. This new trend increased the need to understand the behavior of lead-free solders.

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