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  2. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    Solder paste is used in the manufacture of ... in size and have a low ... room temperature for use. Recently, new solder pastes have been introduced that remain ...

  3. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Cd70, thermal-free solder. Produces low thermal EMF joints in copper, does not form parasitic thermocouples. Used in low-temperature physics. [2] Sn 40 Pb 42 Cd 18: 145: Cd, Pb: Low melting temperature allows repairing pewter and zinc objects, including die-cast toys. Sn 50 Pb 32 Cd 18: 145 [16] Cd, Pb: Cd18: Cd 82.5 Zn 17.5: 265 [27] Cd: Yes

  4. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Reflow soldering is a process in which a solder paste (a mixture of prealloyed solder powder and a flux-vehicle that has a peanut butter-like consistency [8]) is used to stick the components to their attachment pads, after which the assembly is heated by an infrared lamp, a hot air pencil, or, more commonly, by passing it through a carefully ...

  5. Glass frit bonding - Wikipedia

    en.wikipedia.org/wiki/Glass_frit_bonding

    To achieve process temperatures beneath 450 °C leaded glass or lead silicate glass is used. The glass frit is a paste consisting glass powder, organic binder, inorganic fillers and solvents. This low melting glass paste is milled into powder (grain size < 15 μm) and mixed with organic binder forming a printable viscous paste. [3]

  6. Reflow soldering - Wikipedia

    en.wikipedia.org/wiki/Reflow_soldering

    Too high a temperature can lead to solder spattering or balling as well as oxidation of the paste, the attachment pads and the component terminations. Similarly, fluxes may not fully activate if the temperature is too low. At the end of the soak zone a thermal equilibrium of the entire assembly is desired just before the reflow zone. A soak ...

  7. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]

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