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  2. Cascade Microtech - Wikipedia

    en.wikipedia.org/wiki/Cascade_Microtech

    In 2017, Cascade Microtech, together with Imec, developed a fully-automatic system to pre-bond test advanced 3D chips. The two companies won the 2017 National Instruments Engineering Impact Award in the electronics and semiconductor division for their development in which they titled "Probing of Large-Array, Fine-Pitch Microbumps for 3D ICs".

  3. Hot-tube ignitor - Wikipedia

    en.wikipedia.org/wiki/Hot-tube_ignitor

    The tubes used were typically 6 to 12 inches long, which tended to make them impractical for use on anything but large engines (e.g., stationary motors in factories). Tubes rarely lasted longer than a year before needing replacement, especially when the engines were fueled with high sulfur gases like unpurified producer gas or natural gas.

  4. Capacitor discharge ignition - Wikipedia

    en.wikipedia.org/wiki/Capacitor_discharge_ignition

    Capacitor discharge ignition (CDI) or thyristor ignition is a type of automotive electronic ignition system which is widely used in outboard motors, motorcycles, lawn mowers, chainsaws, small engines, gas turbine-powered aircraft, and some cars.

  5. List of Allis-Chalmers engines - Wikipedia

    en.wikipedia.org/wiki/List_of_Allis-Chalmers_engines

    In a later reversal of this practice, the Engine Division eventually served as a third-party supplier to other makers of farm and industrial machinery, most notably Cockshutt and LeRoi. Allis-Chalmers (and Buda) produced heavy-duty engine designs that were built to handle a variety of fuel types (generally gasoline , diesel fuel , or liquefied ...

  6. Three-dimensional integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Three-dimensional...

    There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]

  7. A Massachusetts man was caught in the middle of some “Santa-antics” and got stuck in a chimney while trying to evade police executing a search warrant on his home.

  8. Rotating detonation engine - Wikipedia

    en.wikipedia.org/wiki/Rotating_detonation_engine

    This engine produced 4,000 lbf (18 kN) of thrust. NASA has stated their intention to create a 10,000-pound-force (44 kN) thrust unit as the next research step. [17] On December 20, 2023, a full-scale Rotating Detonation Rocket Engine combustor was reportedly fired for 251 seconds, achieving more than 5,800-pound-force (26 kN) of thrust.

  9. GM Family 0 engine - Wikipedia

    en.wikipedia.org/wiki/GM_Family_0_engine

    The Family 0 is a family of inline piston engines that was developed by Opel, at the time a subsidiary of General Motors. It was developed as a low-displacement engine for use on entry-level subcompact cars from Opel/Vauxhall. These engines feature a light-weight cast-iron semi-closed deck engine block with an aluminum cylinder head.

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