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  2. Solder - Wikipedia

    en.wikipedia.org/wiki/Solder

    Most lead-free replacements for conventional 60/40 and 63/37 Sn-Pb solder have melting points from 50 to 200 °C higher, [17] though there are also solders with much lower melting points. Lead-free solder typically requires around 2% flux by mass for adequate wetting ability. [18]

  3. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Slightly cheaper than Sn 63 Pb 37, often used instead for cost reasons as the melting point difference is insignificant in practice. On slow cooling gives slightly duller joints than Sn 63 Pb 37. [56] Sn 62 Pb 38: 183: Pb: Near "Tinman's solder", used for tinplate fabrication work. [28] Sn 63 Pb 37: 183 [57] Pb: Yes: Sn63, ASTM63A, ASTM63B ...

  4. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Lead free soldering requires higher soldering temperatures than lead/tin soldering. Sn Pb 63/37 eutectic solder melts at 183 °C. SAC lead-free solder melts at 217–220 °C. Nevertheless, many new technical challenges have arisen with this endeavor.

  5. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method. The melting point of SAC alloys is 217–220 °C, or about 34 °C higher than the melting point of the eutectic tin-lead (63/37) alloy.

  6. Fusible alloy - Wikipedia

    en.wikipedia.org/wiki/Fusible_alloy

    Deforms indefinitely under load. Does not become brittle even at low temperatures. Used as a solder in low-temperature physics, will bond to aluminium. Can be used for soldering to thin metal films or glass with an ultrasonic soldering iron. [4] Li 100: 180.5 °C (356.9 °F) (yes) Sn 62.3, Pb 37.7: 183 °C (361 °F) yes Sn 63.0, Pb 37.0: 183 ...

  7. Eutectic system - Wikipedia

    en.wikipedia.org/wiki/Eutectic_system

    Eutectic alloys for soldering, both traditional alloys composed of lead (Pb) and tin (Sn), sometimes with additional silver (Ag) or gold (Au) — especially Sn 63 Pb 37 and Sn 62 Pb 36 Ag 2 alloy formula for electronics - and newer lead-free soldering alloys, in particular ones composed of tin, silver, and copper (Cu) such as Sn 96.5 Ag 3.5.

  8. RoHS - Wikipedia

    en.wikipedia.org/wiki/RoHS

    The more common lead-free solder systems have a higher melting point, e.g. a 30 °C typical difference for tin-silver-copper alloys, but wave soldering temperatures are approximately the same at ~255 °C; [47] however at this temperature most typical lead-free solders have longer wetting times than eutectic Pb/Sn 37:63 solder. [49]

  9. Talk:Solder - Wikipedia

    en.wikipedia.org/wiki/Talk:Solder

    The page says that 62/38 is near eutectic and that 63/37 is eutectic. 62% SN is actually closer to the true eutectic point. ... Type of solder Melting temperature ...