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Most lead-free replacements for conventional 60/40 and 63/37 Sn-Pb solder have melting points from 50 to 200 °C higher, [17] though there are also solders with much lower melting points. Lead-free solder typically requires around 2% flux by mass for adequate wetting ability. [18]
Similar mechanical properties with Sn 63 Pb 37, Sn 62 Pb 36 Ag 2 and Sn 60 Pb 40, suitable lead-free replacement. Contains eutectic Sn-In phase with melting point at 118 °C, avoid use above 100 °C. Sn 86.9 In 10 Ag 3.1: 204: 205 [48] Yes: Potential use in flip-chip assembly, no issues with tin-indium eutectic phase. In 97 Ag 3: 143 [49] Yes: Yes
Common solder formulations based on tin and lead are listed below. The fraction represent percentage of tin first, then lead, totaling 100%: 63/37: melts at 183 °C (361 °F) (eutectic: the only mixture that melts at a point, instead of over a range) 60/40: melts between 183–190 °C (361–374 °F)
Eutectic alloys for soldering, both traditional alloys composed of lead (Pb) and tin (Sn), sometimes with additional silver (Ag) or gold (Au) — especially Sn 63 Pb 37 and Sn 62 Pb 36 Ag 2 alloy formula for electronics - and newer lead-free soldering alloys, in particular ones composed of tin, silver, and copper (Cu) such as Sn 96.5 Ag 3.5.
BrazeTec 60/40. For brazing zinc-coated tubes. ... Also classified as a solder. Lowest melting point alloy with low vapor pressure. 80: 20: ... 37: 60: In 3: Au 20 Cu ...
One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method. The melting point of SAC alloys is 217–220 °C, or about 34 °C higher than the melting point of the eutectic tin-lead (63/37) alloy.
In electronics applications, where circuits typically operate over a −55 °C to +125 °C range, eutectic tin-lead (Sn63) solder is working at 0.48T mp to 0.87T mp. The upper temperature is high relative to the melting point; from this we can deduce that solder will have limited mechanical strength (as a bulk material) and significant creep ...
This latter combination is strong, has a low melting range, and melts and sets quickly (i.e., no 'plastic' range between the solid and molten states like the older 60% tin / 40% lead alloy). Higher tin compositions give the solder higher corrosion resistances, but raise the melting point. Another common composition is 11% tin, 37% lead, 42% ...
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