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Closeup of the pins of a pin grid array The pin grid array at the bottom of prototype Motorola 68020 microprocessor The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket. A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are ...
CPUs with a PGA (pin grid array) package are inserted into the socket and, if included, the latch is closed. CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands ...
Organic ball-grid array [3] TFBGA: Thin fine-pitch ball-grid array [3] PBGA: Plastic ball-grid array [3] MAP-BGA: Mold array process - ball-grid array : UCSP: Micro (μ) chip-scale package: Similar to a BGA (A Maxim trademark example) [17] μBGA: Micro ball-grid array: Ball spacing less than 1 mm LFBGA: Low-profile fine-pitch ball-grid array [3 ...
Socket 479 (mPGA479M) is a CPU socket used by some Intel microprocessors. It is primarily known as the socket used by Pentium M and Celeron M mobile processors normally found in laptops, however the socket has also been used with Tualatin-M Mobile Celeron and Pentium III processors years before it. [1]
Pins arranged in a 36 × 35 grid array; 18 × 15 size grid removed from the center; Utilization of cam actuated retention mechanism; The r in rPGA refers to "Reduced pitch" which is 1mm × 1mm in this socket design. [5] Socket G1 systems can only run in dual-channel memory mode, compared to the triple-channel mode of LGA 1366, as a result of ...
Unlike pin grid arrays, land grid array packages are designed to fit either in a socket, or be soldered down using surface mount technology. PGA packages cannot be soldered down using surface mount technology. In contrast with a BGA, land grid array packages in non socketed configurations have no balls, and use flat contacts which are soldered ...
Download QR code; Print/export ... Flip-chip pin grid array (FC-PGA2 ... This socket is a 495 pin CPU socket designed to house any processor in the Socket 495 package ...
Socket 603 was designed by Intel as a zero insertion force socket intended for workstations and server platforms. It contains 603 contacts arrayed in a grid about the center of the socket, each contact has a 1.27mm pitch with regular pin array, to mate with a 603-pin processor package.