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  2. Thermal copper pillar bump - Wikipedia

    en.wikipedia.org/wiki/Thermal_copper_pillar_bump

    A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).

  3. Vertiv - Wikipedia

    en.wikipedia.org/wiki/Vertiv

    Vertiv is an American multinational provider of critical infrastructure and services for data centers, communication networks, and commercial and industrial environments. ...

  4. Flip chip - Wikipedia

    en.wikipedia.org/wiki/Flip_chip

    Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.

  5. Hands-free computing - Wikipedia

    en.wikipedia.org/wiki/Hands-free_computing

    Hands-free computing is important because it is useful to both able and disabled users. Speech recognition systems can be trained to recognize specific commands and upon confirmation of correctness instructions can be given to systems without the use of hands. This may be useful while driving or to an inspector or engineer in a factory environment.

  6. National Register of Historic Places listings in Columbus, Ohio

    en.wikipedia.org/wiki/National_Register_of...

    The city of Columbus is the location of 183 of these properties and districts, including all of the National Historic Landmarks; they are listed here, while the remaining properties and districts are listed separately. Another 3 properties were once listed but have been removed.

  7. Electron-beam technology - Wikipedia

    en.wikipedia.org/wiki/Electron-beam_technology

    Electron-beam evaporation uses thermionics emission to create a stream of electrons that are accelerated by a high-voltage cathode and anode arrangement. Electrostatic and magnetic fields focus and direct the electrons to strike a target. The kinetic energy is transformed into thermal energy at or near the surface of the material.

  8. Corona treatment - Wikipedia

    en.wikipedia.org/wiki/Corona_treatment

    Many substrates provide a better bonding surface when they are treated at the time they are produced. This is called “pre-treatment.” The effects of corona treatment diminish over time. Therefore, many surfaces will require a second “bumptreatment at the time they are converted to ensure bonding with printing inks, coatings, and ...

  9. Non-contact thermography - Wikipedia

    en.wikipedia.org/wiki/Non-contact_thermography

    Sample image of a hand held thermography camera There is a difference between Medical Thermology as promulgated by medically based organizations such as the American Academy of Thermology (AAT), and thermography as practiced by alternative providers or physicians who overstate the benefits of thermography.