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  2. TO-220 - Wikipedia

    en.wikipedia.org/wiki/TO-220

    The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more.

  3. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink system curve can be calculated by the flow resistance of the channels and inlet and outlet losses as done in standard fluid mechanics text books, such as Potter, et al. [27] and White. [28] Once the heat sink base and fin resistances are known, then the heat sink thermal resistance, can be calculated as:

  4. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  5. TO-3 - Wikipedia

    en.wikipedia.org/wiki/TO-3

    The case is used with high-power and high-current devices, on the order of a few tens of amperes current and up to a hundred watts of heat dissipation. The case surfaces are metal for good heat conductivity and durability. The metal-to-metal and metal-to-glass joints provide hermetic seals that protect the semiconductor from liquids and gases.

  6. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Aluminum is also much lighter than copper, offering less mechanical stress on delicate electronic components. Some heat sinks made from aluminum have a copper core as a trade off. The heat sink's contact surface (the base) must be flat and smooth to ensure the best thermal contact with the object needing cooling.

  7. Power module - Wikipedia

    en.wikipedia.org/wiki/Power_module

    A further aspect for optimization is the so-called thermal path between the heat source (the dies) and the heat-sink. The heat has to pass through different physical layers such as solder, DCB, baseplate, thermal interface material and the bulk of the heat-sink, until it is transferred to a gaseous medium such as air or a fluid medium such as ...

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