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Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]
Before plating, the surface of the material must be thoroughly cleaned. Unwanted solids left on the surface cause poor plating. Cleaning is usually achieved by a series of chemical baths, including non-polar solvents to remove oils and greases, as well as acids and alkalis to remove oxides, insoluble organics, and other surface contaminants.
Electroless processes are widely used to deposit nickel-phosphorus or nickel-boron alloys for wear and corrosion resistance, silver for mirror-making, copper for printed circuit boards, and many more. A major advantage of these processes over electroplating is that they can produce coatings of uniform thickness over surfaces of arbitrary shape ...
Common Lewis acid catalysts are based on main group metals such as aluminum, boron, silicon, and tin, as well as many early (titanium, zirconium) and late (iron, copper, zinc) d-block metals. The metal atom forms an adduct with a lone-pair bearing electronegative atom in the substrate, such as oxygen (both sp 2 or sp 3 ), nitrogen , sulfur ...
Nickel boride is the common name of materials composed chiefly of the elements nickel and boron that are widely used as catalysts in organic chemistry. [1] [2] Their approximate chemical composition is Ni 2.5 B, [3] and they are often incorrectly denoted "Ni 2 B" in organic chemistry publications.
It has good corrosion resistance. Its zinc content may cause problems; zinc outgassing can be reduced by nickel-plating. Indium wire is used as a gasket in demountable seals. Gold wire is used as a gasket in demountable seals for ultra-high vacuum, as well as an alternative to lead-tin solder for making electrical connections.
Neptunium(IV) chloride – NpCl 4; Nickel(II) chloride – NiCl 2; Niobium oxide trichloride – NbOCl 3; Niobium(IV) chloride – NbCl 4; Niobium(V) chloride – NbCl 5; Nitrogen trichloride – NCl 3; Nitrosyl chloride – NOCl; Nitryl chloride – NO 2 Cl; Osmium(III) chloride – OsCl 3; Palladium(II) chloride – PdCl 2; Perchloric acid ...
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