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Reinforced skin closures: These are sterile skin closure strips that are made of a porous, non-woven backing coated with a pressure-sensitive, hypoallergenic adhesive and reinforced with polyester filaments for added strength. They provide general wound support for increased tensile strength and finer wound edge approximation.
Nexcare is 3M's personal health care brand. The brand competes with Johnson & Johnson's Band-Aid brand in the adhesive bandage and first aid market. [1] [2] The brand also sells similar products such as bandages, gauze, surgical tape, cold sore treatment and liquid bandage products.
The word is a portmanteau of the words thin and insulate, trademarked by 3M. [1] The material is made by the 3M Corporation and was first sold in 1979. [ 2 ] It was originally marketed as an inexpensive alternative to down; at the time, 3M claimed it was twice as warm as an equivalent amount of any natural material.
Minnesota-based industrial giant 3M Co (NYSE: MMM) just keeps chugging along, with new leadership in the C-suite and a litany of positive, bottom line financial news heading into the last half of ...
A dermal adhesive (or skin glue) is a glue used to close wounds in the skin as an alternative to sutures, staples, or clips. Glued closure results in less scarring and is less prone to infection than sutured or stapled closure. There is also no residual closure to remove, so follow-up visits for removal are not required.
Cyanoacrylate-based glue has a weak bond with smooth surfaces and as such easily gives to friction; a good example of this is the fact that cyanoacrylates may be removed from human skin by means of abrasives (e.g. sugar or sandpaper).
When the 2-octyl cyanoacrylate monomers are exposed to anions, provided either by moisture from the skin or exudate they quickly polymerize causing an exothermic reaction binding to the most superficial layer of epithelium. The seal formed by the cyanoacrylate is water tight allowing for the wound to heal uninterrupted.
Adhesive bonding has the advantage of relatively low bonding temperature as well as the absence of electric voltage and current. Based on the fact that the wafers are not in direct contact, this procedure enables the use of different substrates, e.g. silicon, glass, metals and other semiconductor materials.
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