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  2. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Cold solder joints are dull and sometimes cracked or pock-marked. If the joint has lumps or balls of otherwise shiny solder, the metal has not wetted properly. Too much solder (the familiar 'solder blob' to beginners) is not necessarily unsound, but tends to mean poor wetting. A concave fillet is ideal. The boundary between the solder and the ...

  3. Wave soldering - Wikipedia

    en.wikipedia.org/wiki/Wave_soldering

    Wave soldering is a bulk soldering process used in printed circuit board manufacturing. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board.

  4. Point-to-point construction - Wikipedia

    en.wikipedia.org/wiki/Point-to-point_construction

    Solder makes a strong electrical and mechanical connection. Point-to-point wiring is not suitable for automated assembly (though see wire wrap , a similar method that is) and is carried out manually, making it both more expensive and more susceptible to wiring errors than PCBs, as connections are determined by the person doing assembly rather ...

  5. Component placement - Wikipedia

    en.wikipedia.org/wiki/Component_placement

    Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously ...

  6. Solderability - Wikipedia

    en.wikipedia.org/wiki/Solderability

    Both quantitative and qualitative tests for solderability exist. [6] The two most common testing methods are the 'dip and look' method and wetting balance analysis.In both of these tests, the soldered pieces undergo an accelerated aging process before being tested for solderability, to take into consideration the time a component was in storage prior to mounting to final assembly.

  7. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...

  8. Rework (electronics) - Wikipedia

    en.wikipedia.org/wiki/Rework_(electronics)

    Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...

  9. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    Not to be confused with Printed electronics. "PC board" redirects here. For the mainboard of personal computers, see Motherboard. "Panelization" redirects here. For the page layout strategy, see N-up. Printed circuit board of a DVD player Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the conductive traces, the through-hole paths to the other surface, and ...

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