Search results
Results from the WOW.Com Content Network
The 2005 Farnell/Newark InOne "RoHS Legislation and Technical Manual", [52] cites these and other "lead-free" solder issues, such as: Warping or delamination of printed circuit boards; Damage to through-holes, ICs and components on circuit boards; and, Added moisture sensitivity, all of which may compromise quality and reliability.
China RoHS II expanded the product scope of China RoHS I from Electronic Information Products (EIP) to Electrical and Electronic Products (EEP). [3] Products listed in the EEP Catalogue must comply with hazardous substance restriction limits for lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated ...
In computer design, Pico-ITX is a PC motherboard form factor announced by VIA Technologies in January 2007 and demonstrated later the same year at CeBIT. The formfactor was transferred over to SFF-SIG in 2008. The Pico-ITX form factor specifications call for the board to be 10 × 7.2 cm (3.9 × 2.8 in), which is half the area of Nano-ITX.
Sun Fire X4100 cluster Sun Fire X4150 Motherboard Sun Fire X4200 servers. Sun Fire is a series of server computers introduced in 2001 by Sun Microsystems (since 2010, part of Oracle Corporation). The Sun Fire branding coincided with the introduction of the UltraSPARC III processor, superseding the UltraSPARC II-based Sun Enterprise series.
C7-D: similar to original C7, but RoHS-compliant [1] and marketed as "carbon-free processor". Some variants do not support PowerSaver [ citation needed ] Eden : Some VIA Eden CPUs are based on a C7 core with low power consumption, package size, and clock rates as low as 400 MHz.
AMD chipsets logo. This is an overview of chipsets sold under the AMD brand, manufactured before May 2004 by the company itself, before the adoption of open platform approach as well as chipsets manufactured by ATI Technologies after October 2006 as the completion of the ATI acquisition.
The rear panel aperture is identical to the EEB and ATX specification and expansion cards mounted on an SSI CEB motherboard appear much the same as they would on an ATX motherboard. To standardize thermal behavior, processor position is defined, including primary and secondary processor identification.
HASL or HAL (for hot air (solder) leveling) is a type of finish used on printed circuit boards (PCBs).. The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder.