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ARINC 818 (Avionics Digital Video Bus) is a point-to-point, 8b/10b-encoded (or 64B/66B for higher speeds) serial protocol for transmission of video, audio, and data. The protocol is packetized but is video-centric and very flexible, supporting an array of complex video functions including the multiplexing of multiple video streams on a single link or the transmission of a single stream over a ...
UPI is a low-latency coherent interconnect for scalable multiprocessor systems with a shared address space. It uses a directory-based home snoop coherency protocol with a transfer speed of up to 10.4 GT/s. Supporting processors typically have two or three UPI links.
O3b mPOWER is a communications satellite system owned and operated by SES.The system uses high-throughput and low-latency satellites in a medium Earth orbit (MEO), along with ground infrastructure and intelligent software, to provide multiple terabits of global broadband connectivity for applications including cellular backhaul and international IP trunking, cruise line connectivity, disaster ...
The current specification HTX 3.1 remained competitive for 2014 high-speed (2666 and 3200 MT/s or about 10.4 GB/s and 12.8 GB/s) DDR4 RAM and slower (around 1 GB/s similar to high end PCIe SSDs ULLtraDIMM flash RAM) technology [clarification needed] —a wider range of RAM speeds on a common CPU bus than any Intel front-side bus. Intel ...
InfiniBand (IB) is a computer networking communications standard used in high-performance computing that features very high throughput and very low latency.It is used for data interconnect both among and within computers.
High bandwidth memory (HBM) are basically a stack of memory chips, small components that store data. They can store more information and transmit data more quickly than the older technology ...
The chiplets are interconnected by AMD’s Infinity Fabric, which enables high-speed and low-latency data transfer between the chiplets and the host system. The MI300A is an accelerated processing unit (APU) that integrates 24 Zen 4 CPU cores with four CDNA 3 GPU cores, resulting in a total of 228 CUs in the GPU section, and 128 GB of HBM3 ...
In April, the Nvidia supplier said it would invest $3.87 billion to build the West Lafayette facility which will include an assembly line to mass produce next-generation high bandwidth memory chips.