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Plasma cutting is a process that cuts through electrically conductive materials by means of an accelerated jet of hot plasma. Typical materials cut with a plasma torch include steel, stainless steel, aluminum, brass and copper, although other conductive metals may be cut as well. Plasma cutting is often used in fabrication shops, automotive ...
Plasma activation. Plasma activation (or plasma functionalization) is a method of surface modification employing plasma processing, which improves surface adhesion properties of many materials including metals, glass, ceramics, a broad range of polymers and textiles and even natural materials such as wood and seeds.
Plasma torch. A plasma torch cutter. A plasma torch (also known as a plasma arc, plasma gun, plasma cutter, or plasmatron) is a device for generating a directed flow of plasma. [1][2][3] The plasma jet can be used for applications including plasma cutting, plasma arc welding, plasma spraying, and plasma gasification for waste disposal. [4]
Plasma processing is a plasma -based material processing technology that aims at modifying the chemical and physical properties of a surface. [1] Plasma processing techniques include: Related topics are plasma chemistry, chemical vapor deposition, and physical vapor deposition processes like sputter deposition, plasma iondoping, vacuum ...
Plasma electrolytic oxidation (PEO), also known as electrolytic plasma oxidation (EPO) or microarc oxidation (MAO), is an electrochemical surface treatment process for generating oxide coatings on metals. It is similar to anodizing, but it employs higher potentials, so that discharges [1] occur and the resulting plasma modifies the structure of ...
PECVD machine at LAAS technological facility in Toulouse, France. Plasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases.
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