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Solder mask, solder stop mask or solder resist is a thin lacquer-like layer of polymer that is usually applied to the copper traces of a printed circuit board (PCB) for protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads.
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
PCBs may be plated with solder, tin, or gold over nickel. [18] [19] After PCBs are etched and then rinsed with water, the solder mask is applied, and then any exposed copper is coated with solder, nickel/gold, or some other anti-corrosion coating. [20] It is important to use solder compatible with both the PCB and the parts used.
The solder mask materials have no affinity to the molten solder and hence, no positive bonding is formed between them as the solder solidifies. ... Stencil thickness ...
On the common FR-4 substrates, 1 oz copper per ft 2 (35 μm) is the most common thickness; 2 oz (70 μm) and 0.5 oz (17.5 μm) thickness is often an option. Less common are 12 and 105 μm, 9 μm is sometimes available on some substrates.
Film coatings ranging from 0.100 to 76 μm can be applied in a single operation. The coating thickness is uniform, even on irregular surfaces. Desired contact points, such as battery contacts or connectors, must be covered with an air-tight mask to prevent the parylene from coating the contacts. Applying parylene is a batch process that does ...
Solder paste is typically used in a stencil-printing process by a solder paste printer, [6] in which paste is deposited over a stainless steel or polyester mask to create the desired pattern on a printed circuit board.
Board Thickness and Laminate Material: Board thickness and laminate material properties such as Young's modulus and Coefficient of Thermal Expansion (CTE) will impact susceptibility to pad cratering. Board Redesign: If pad cratering persists then a redesign may be required.
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