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  2. Wafer testing - Wikipedia

    en.wikipedia.org/wiki/Wafer_testing

    Wafer testing is a step performed during semiconductor device fabrication after back end of line (BEOL) and before IC packaging.. Two types of testing are typically done. Very basic wafer parametric tests (WPT) are performed at a few locations on each wafer to ensure the wafer fabrication process has been carried out successfully.

  3. Parallel Walk Test - Wikipedia

    en.wikipedia.org/wiki/Parallel_Walk_Test

    The test takes 3–5 minutes and consists of walking 6 meters between 2 parallel lines measured 8”, 12” and 15” across in width. The test is scored based on number of stepping errors, i.e. stepping on a line (+1) or stepping over a line (+2), where a higher score denotes decrease performance and total time to perform walk. [2]

  4. Dadda multiplier - Wikipedia

    en.wikipedia.org/wiki/Dadda_multiplier

    4 layer Dadda reduction of an 8x8 partial product matrix, using 7 half adders (two dots) and 35 full adders (three dots). The dots in each column are bits of equal weight. Bits with lower weight are rightmost. The example in the adjacent image illustrates the reduction of an 8 × 8 multiplier, explained here.

  5. Linear multistep method - Wikipedia

    en.wikipedia.org/wiki/Linear_multistep_method

    The first Dahlquist barrier states that a zero-stable and linear q-step multistep method cannot attain an order of convergence greater than q + 1 if q is odd and greater than q + 2 if q is even. If the method is also explicit, then it cannot attain an order greater than q ( Hairer, Nørsett & Wanner 1993 , Thm III.3.5).

  6. Autofrettage - Wikipedia

    en.wikipedia.org/wiki/Autofrettage

    Autofrettage is a work-hardening process in which a pressure vessel (thick walled) is subjected to enormous pressure, causing internal portions of the part to yield plastically, resulting in internal compressive residual stresses once the pressure is released. The goal of autofrettage is to increase the pressure-carrying capacity of the final ...

  7. Dye penetrant inspection - Wikipedia

    en.wikipedia.org/wiki/Dye_penetrant_inspection

    The end goal of this step is a clean surface where any defects present are open to the surface, dry, and free of contamination. Note that if media blasting is used, it may "work over" small discontinuities in the part, and an etching bath is recommended as a post-blasting treatment. Application of the penetrant to a part in a ventilated test ...

  8. Random dot stereogram - Wikipedia

    en.wikipedia.org/wiki/Random_dot_stereogram

    The process used to develop the first random-dot stereogram is illustrated below. 1. Create an image of suitable size. Fill it with random dots. Duplicate the image. 2. Select a region in one image, in this case, in the right image. 3. Shift this region horizontally by one or two dot diameters and fill in the empty region with new random dots.

  9. Closed testing procedure - Wikipedia

    en.wikipedia.org/wiki/Closed_testing_procedure

    The Holm–Bonferroni method is a special case of a closed test procedure for which each intersection null hypothesis is tested using the simple Bonferroni test.