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  2. Advanced packaging (semiconductors) - Wikipedia

    en.wikipedia.org/wiki/Advanced_packaging...

    Advanced packaging [1] is the aggregation and interconnection of components before traditional integrated circuit packaging where a single die is packaged. Advanced packaging allows multiple devices, including electrical, mechanical, or semiconductor devices, to be merged and packaged as a single electronic device.

  3. UFP Technologies - Wikipedia

    en.wikipedia.org/wiki/UFP_Technologies

    UFP Technologies acquired three companies in 2009: Advanced Materials Group, a foam fabricator based in Rancho Dominguez, California, [12] Foamade Industries Inc., a manufacturer of foam products and industrial machinery [13] and E.N. Murray, a designer, converter, and distributor of foam plastic products, specializing in technical polyurethane ...

  4. Transit case - Wikipedia

    en.wikipedia.org/wiki/Transit_case

    The principle design of a transit case is to assure environmental sealing and protection for the contents in adverse circumstances. Thus, construction techniques that provide seamless components (body, lid, end caps) are primarily used: rotomolded and thermoformed polyethylene, rotomolded LLDPE thermoplastic, deep drawn aluminum, fiberglass reinforced thermoset composites, FRP composite ...

  5. Rudolph Enters Back-End Lithography Market with Breakthrough ...

    www.aol.com/news/2012-12-12-rudolph-enters-back...

    The Azores acquisition uniquely positions Rudolph in the back-end stepper advanced packaging photolithography market with a significantly expanded business model, and we believe that by offering ...

  6. Cruz Foam's chitin-based packaging brings in $18M as ... - AOL

    www.aol.com/news/cruz-foams-chitin-based...

    The best way to remove plastics from the ecosystem is to make sure they never get there in the first place, and Cruz Foam is well on its way to replacing some of the worst ones out there with its ...

  7. Exclusive-TSMC considering advanced chip packaging ... - AOL

    www.aol.com/news/exclusive-tsmc-considering...

    Advanced packaging would be welcomed in Japan which can offer the ecosystem to support it, a senior official at Japan's industry ministry said. TrendForce analyst Joanne Chiao said, however, that ...

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