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Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...
These techniques are usually used when the die will be wire bonded; dies with flip chip technology do not use these attachment techniques. [15] [16] IC bonding is also known as die bonding, die attach, and die mount. [17] The following operations are performed at the packaging stage, as broken down into bonding, encapsulation, and wafer bonding ...
During the compliant bonding cycle the bond pressure is uniquely controlled by the inherent flow properties of the aluminum compliant tape (Figure 3). Therefore, if higher bond pressures are needed to increase the final deformation (flatness) of a compliant bonded gold wire, a higher yielding alloy of aluminum could be employed.
The die is glued or soldered to the die pad inside the lead frame, and then bond wires are attached between the die and the bond pads to connect the die to the leads in a process called wire bonding. In a process called encapsulation, a plastic case is moulded around the lead frame and die, exposing only the leads.
In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.
Glob-top is a variant of conformal coating used in chip-on-board assembly (COB). It consists of a drop of specially formulated epoxy [4] or resin deposited over a semiconductor chip and its wire bonds, to provide mechanical support and exclude contaminants such as fingerprint residues which could disrupt circuit operation. It is most commonly ...
Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father of Thermosonic Bonding" by George Harman, [ 1 ] the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics .
Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILEX) film carrier. This FPC with the die(s) (TAB inner lead bonding, ILB) can be mounted on the system ...