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1×6 pin header (one row) 1×6 female header (one row) A pin header (or simply, header) is a form of electrical connector.A male pin header consists of one or more rows of metal pins molded into a plastic base, often 2.54 mm (0.1 in) apart, though available in many spacings. [1]
The plastic connector housing is most often white, as shown (TE Connectivity / AMP 171822-4), but black is also common. Other colours are rarer. The part numbers used for the female contact pins depends on the detailed design, the surface coating (for example tinned or gold plated) and the form of supply.
Uranium glass used as lead-in seals in a vacuum capacitor. Glass-to-metal seals are a type of mechanical seal which joins glass and metal surfaces. They are very important elements in the construction of vacuum tubes, electric discharge tubes, incandescent light bulbs, glass-encapsulated semiconductor diodes, reed switches, glass windows in metal cases, and metal or ceramic packages of ...
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Hot tin-dipping is the process of immersing a part into a bath of pure molten tin at a temperature greater than 450 °F or 232 °C. Tinplate made via hot-dipped tin plating is made by cold rolling steel or iron, pickling to remove any scale, annealing to remove any strain hardening, and then coating it with a thin layer of tin.
Also, larger aluminum stranded building wire made with AA-8000 series alloy of aluminum is used for electrical services (e.g. service entrance conductors from the utility connection to the service breaker panel) and for larger branch circuits such as for sub-panels, ranges, clothes dryers and air-conditioning units.
The gold-tin intermetallics layer is responsible for poor mechanical reliability of tin-soldered gold-plated surfaces where the gold plating did not completely dissolve in the solder. Two processes play a role in a solder joint formation: interaction between the substrate and molten solder, and solid-state growth of intermetallic compounds.
The tinning set consisted of two pots with molten tin (with flux on top) and a grease pot. The flux dries the plate and prepares it for the tin to adhere. The second tin pot (called the wash pot) had tin at a lower temperature. This is followed by the grease pot (containing an oil), removing the excess tin. Then follow cleaning and polishing ...