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The melting point of SAC alloys is 217–220 °C, or about 34 °C higher than the melting point of the eutectic tin-lead (63/37) alloy. This requires peak temperatures in the range of 235–245 °C to achieve wetting and wicking. [1]
Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. Sn 62 Pb 37 Cu 1: 183 [17] Pb: Yes: Similar to Sn 63 Pb 37. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. Sn 63 Pb 37 P 0.0015-0.04: 183 ...
Most lead-free replacements for conventional 60/40 and 63/37 Sn-Pb solder have melting points from 50 to 200 °C higher, [17] though there are also solders with much lower melting points. Lead-free solder typically requires around 2% flux by mass for adequate wetting ability. [18]
If all metal surfaces have not been properly cleaned ("fluxed") or brought entirely above the melting temperature of the solder used, the result will be an unreliable ("cold solder") joint, even though its appearance may suggest otherwise. Excess solder, unconsumed flux and residue is sometimes wiped from the soldering iron tip between joints.
Higher tin compositions give the solder higher corrosion resistances, but raise the melting point. Another common composition is 11% tin, 37% lead, 42% bismuth, and 10% cadmium. This combination has a low melting point and is useful for soldering components that are sensitive to heat.
Additionally, for a given fixed homologous temperature, two materials with different melting points would have similar diffusion-dependent deformation behaviour. For example, solder (T mp = 456 K) at 115 °C would have comparable mechanical properties to copper (T mp = 1358 K) at 881 °C, because they would both be at 0.85T mp despite being at ...
Tin-lead and tin-copper alloys such as Babbitt metal [2] have a low melting point, which is ideal for use as solder, but these alloys also have ideal characteristics for plain bearings. Most importantly for bearings, the material should be hard and wear-resistant and have a low coefficient of friction.
For pure elements or compounds, e.g. pure copper, pure water, etc. the liquidus and solidus are at the same temperature, and the term melting point may be used. There are also some mixtures which melt at a particular temperature, known as congruent melting. One example is eutectic mixture. In a eutectic system, there is particular mixing ratio ...