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Electroless nickel-phosphorus plating, also referred to as E-nickel, is a chemical process that deposits an even layer of nickel-phosphorus alloy on the surface of a solid substrate, like metal or plastic.
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]
Electroless processes are widely used to deposit nickel-phosphorus or nickel-boron alloys for wear and corrosion resistance, silver for mirror-making, copper for printed circuit boards, and many more. A major advantage of these processes over electroplating is that they can produce coatings of uniform thickness over surfaces of arbitrary shape ...
A process flow diagram (PFD) is a diagram commonly used in chemical and process engineering to indicate the general flow of plant processes and equipment. The PFD displays the relationship between major equipment of a plant facility and does not show minor details such as piping details and designations.
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Engineering nickel is used where brightness is not desired. Non decorative applications provide wear and corrosion protection as well as low-stress buildups for dimensional recovery, [11] [16] nickel or its nickel alloys usually having matte or dull finish. [8] The method can be used for making nanocomposite wear resistance coatings. [17] [18]
P&IDs are originally drawn up at the design stage from a combination of process flow sheet data, the mechanical process equipment design, and the instrumentation engineering design. During the design stage, the diagram also provides the basis for the development of system control schemes, allowing for further safety and operational ...