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Passive heatsink cooling involves attaching a block of machined or extruded metal to the part that needs cooling. A thermal adhesive may be used. More commonly for a personal computer CPU, a clamp holds the heatsink directly over the chip, with a thermal grease or thermal pad spread between. This block has fins and ridges to increase its ...
Efficient heat sinks are vital to overclocked computer systems because the higher a microprocessor's cooling rate, the faster the computer can operate without instability; generally, faster operation leads to higher performance. Many companies now compete to offer the best heat sink for PC overclocking enthusiasts.
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
The Framework Laptop received a 10 out of 10 in iFixit's repairability score. [24] [25] The standard Framework Laptop ships as a fully assembled laptop, while the Framework Laptop DIY Edition ships with the RAM, storage, operating system, and in 11th Gen, the WiFi module uninstalled. All of these modules can be ordered with the DIY edition for ...
The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
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ASUS released a version of the Eee PC with Microsoft Windows XP pre-installed in January 2008. In Japan, the version is known as the 4G-X. Some early 700-series models drained the battery approximately 10% per day when the unit was completely powered off and not plugged in, thus emptying the battery even when not in use. [9]
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...
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