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Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
However, only solid→liquid and liquid→solid phase changes are practical for PCMs. Although liquid–gas transitions have a higher heat of transformation than solid–liquid transitions, liquid→gas phase changes are impractical for thermal storage because large volumes or high pressures are required to store the materials in their gas phase.
Thermal tape: These materials adhere to the bonded surfaces, require no curing time, they are easy to apply. Similar to thermal pads, they are typically shipped in a solid but flexible form and come in a variety of thicknesses larger than a few hundred μm. Phase-change materials (PCM): Naturally sticky materials, used in place of thermal ...
Phase-change cooling is an extremely effective way to cool the processor. A vapor compression phase-change cooler is a unit that usually sits underneath the PC, with a tube leading to the processor. Inside the unit is a compressor of the same type as in an air conditioner. The compressor compresses a gas (or mixture of gases) which comes from ...
Single-phase immersion uses a circulation method for the dielectric liquid across hot electronic components and to a heat exchanging approach. A single-phase fluid does not boil or undergo a phase change at any time during the cooling process. Two-phase immersion leverages the heat-absorbing phase change from liquid to gas. [3]
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
Thermal performance Thermal paste: Messy. Labor-intensive. Relatively long assembly time. ++++ Epoxy: Creates "permanent" interface bond. ++++ Phase change: Allows for pre-attachment. Softens and conforms to interface defects at operational temperatures. Can be repositioned in field. ++++ Thermal tapes, including graphite, polyimide, and ...
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