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  2. Pergolide - Wikipedia

    en.wikipedia.org/wiki/Pergolide

    Pergolide, sold under the brand name Permax and Prascend (veterinary) among others, is an ergoline-based dopamine receptor agonist used in some countries for the treatment of Parkinson's disease. Parkinson's disease is associated with reduced dopamine synthesis in the substantia nigra of the brain .

  3. Organoaluminium chemistry - Wikipedia

    en.wikipedia.org/wiki/Organoaluminium_chemistry

    The first organoaluminium compound with an Al-Al bond was reported in 1988 as (((Me 3 Si) 2 CH) 2 Al) 2 (a dialane). They are typically prepared reduction of the dialkylaluminium chlorides by metallic potassium: [6] (R 2 AlCl) 2 + 2 K → R 2 Al-AlR 2 + 2 KCl. Another notable group of alanes are tetraalanes containing four Al(I) centres.

  4. Aluminium compounds - Wikipedia

    en.wikipedia.org/wiki/Aluminium_compounds

    Aluminium (British and IUPAC spellings) or aluminum (North American spelling) combines characteristics of pre- and post-transition metals. Since it has few available electrons for metallic bonding, like its heavier group 13 congeners, it has the characteristic physical properties of a post-transition metal, with longer-than-expected interatomic ...

  5. Aluminium(I) compounds - Wikipedia

    en.wikipedia.org/wiki/Aluminium(I)_compounds

    β-diketiminato aluminium alkyls and aluminium halides are synthesized by adding a trialkyl aluminium compound to the initial β-diketiminate ligands, adding iodine, and the reducing with potassium. [10] A synthetic route to aluminum (I) complexes supported by β-diketiminate ligands. [11]

  6. Superconducting wire - Wikipedia

    en.wikipedia.org/wiki/Superconducting_wire

    Its disadvantages include the cost of refrigeration of the wires to superconducting temperatures (often requiring cryogens such as liquid nitrogen or liquid helium), the danger of the wire quenching (a sudden loss of superconductivity), the inferior mechanical properties of some superconductors, and the cost of wire materials and construction. [2]

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  8. Wire bonding - Wikipedia

    en.wikipedia.org/wiki/Wire_bonding

    Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...

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