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The second most important part of FBE coatings is the curing agent or hardener. Curing agents react either with the epoxy ring or with the hydroxyl groups, along the epoxy molecular chain. Various types of curing agents, used in FBE manufacture, include dicyandiamide, aromatic amines, aliphatic diamines and organic acid anhydrides. [6]
The fillers are used to fill pores or imperfections in natural stone products. In the natural stone sector the most frequently implemented adhesive systems are based on epoxy resins (EP resins) and unsaturated polyester resins (UP resins) as well as acrylic resins, methacrylate resins and polyurethane systems (PUR resins). However, there are ...
Until the invention of epoxy resin, resorcinol was one of the most common marine glues. Unlike epoxy, it does not have gap filling properties, requiring joints to be close fitting and clamped under pressure to achieve good results. The glue comes in two parts, a deep red syrup and a light brown powder, that are mixed to form a dark reddish ...
The left component is Epoxy Base Resin and the right one is Epoxy Hardener. Both are to be mixed thoroughly in equal quantity to get epoxy putty. Epoxy putty refers to a group of room-temperature-hardening substances used as space-filling adhesives. Exact compositions vary according to manufacturer and application.
Today, epoxy and the acrylic types predominate. The description and the generally touted advantages are as follows: Epoxy: Although aliphatic epoxy materials have been used, the majority of EPD epoxy types are based on aromatic epoxy polymers, most commonly based on polymerization of diglycidal ethers of bis phenol A. The polymer backbone may ...
Epoxy is the family of basic components or cured end products of epoxy resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also collectively called epoxy. [1] The IUPAC name for an epoxide group is an oxirane.
After evaporation of the solvent, a solid compound is formed. Chemical bonds are also important in certain adhesive / substrate combinations, for example when bonding glass using silicone adhesives, wood using polyurethane adhesives and aluminium using epoxy adhesives. Chemical bonding leads to significantly higher adhesion than physical bonding.
A small transformer potted in epoxy. The surface visible on the right is formed by the potting compound that has been poured into the plastic box. In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound.