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A via, sometimes called PTV or plated-through-via, should not be confused with a plated through hole (PTH). A via is used as an interconnection between copper layers on a PCB while the PTH is generally made larger than vias and is used as a plated hole for acceptance of component leads - such as non-SMT resistors, capacitors, and DIP package IC.
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.
Through-hole (leaded) resistors. In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines.
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In a departure from both 10BASE-T and 100BASE-TX, 1000BASE-T and faster use all four cable pairs for simultaneous transmission in both directions through the use of telephone hybrid-like signal handling. For this reason, there are no dedicated transmit and receive pairs. 1000BASE-T and faster require either a straight or one of the crossover ...
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