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A via, sometimes called PTV or plated-through-via, should not be confused with a plated through hole (PTH). A via is used as an interconnection between copper layers on a PCB while the PTH is generally made larger than vias and is used as a plated hole for acceptance of component leads - such as non-SMT resistors, capacitors, and DIP package IC.
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.
Through-hole (leaded) resistors. In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines.
The term through service may be extended to have a wider meaning encompassing a route which allows the passenger to travel without alighting, for example, in a route change announcement, if a route A-B and a route B-C is combined to A-B-C, it may be described as a new "through service" between A and C. [1] [2] This is in contrast with direct ...
THRU ALL: Through all: Similar to THRU. Sometimes used on hole dimensions for clarity to denote that the hole extends through multiple open space features as it goes through the whole workpiece. [7] TIR: total indicator reading; total indicated run-out: For measurements of eccentricity and other deviations from nominal geometry TOS: top of ...
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