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Advances in thin film deposition techniques during the 20th century have enabled a wide range of technological breakthroughs in areas such as magnetic recording media, electronic semiconductor devices, integrated passive devices, light-emitting diodes, optical coatings (such as antireflective coatings), hard coatings on cutting tools, and for ...
Thin-film deposition is a process applied in the semiconductor industry to grow electronic materials, in the aerospace industry to form thermal and chemical barrier coatings to protect surfaces against corrosive environments, in optics to impart the desired reflective and transmissive properties to a substrate and elsewhere in industry to modify surfaces to have a variety of desired properties.
Thin-film silicon is an alternative to conventional wafer (or bulk) crystalline silicon. While chalcogenide-based CdTe and CIS thin films cells have been developed in the lab with great success, there is still industry interest in silicon-based thin film cells. Silicon-based devices exhibit fewer problems than their CdTe and CIS counterparts ...
Molecular-beam epitaxy (MBE) is an epitaxy method for thin-film deposition of single crystals. MBE is widely used in the manufacture of semiconductor devices, including transistors. [1] MBE is used to make diodes and MOSFETs (MOS field-effect transistors) at microwave frequencies, and to manufacture the lasers used to read optical discs (such ...
The process is often used in the semiconductor industry to produce thin films. [1] In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit.
These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. A thin film is slowly deposited through repeated exposure to separate precursors. ALD is a key process in fabricating semiconductor devices, and part of the set of tools for synthesizing nanomaterials.
Etching is the removal of some portion of the thin film or substrate. The substrate is exposed to an etching (such as an acid or plasma) which chemically or physically attacks the film until it is removed. Etching techniques include: Dry etching (plasma etching) such as reactive-ion etching (RIE) or deep reactive-ion etching (DRIE)
Midsummer AB [2] (Swedish manufacturer of CIGS solar modules and sputtering equipment for thin-film solar cells) Sunflare [3] Sunplugged [4] Solar Cloth [5] Former companies or companies that no longer produce CIGS modules: IBM; International Solar Electric Technology; Flisom (founded in 2005 as a spin-off company of ETH Zürich, Switzerland)
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