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The USB 3.1 specification takes over the existing USB 3.0's SuperSpeed USB transfer rate, now referred to as USB 3.1 Gen 1, and introduces a faster transfer rate called SuperSpeed USB 10 Gbps, corresponding to operation mode USB 3.1 Gen 2, [62] putting it on par with a single first-generation Thunderbolt channel.
Therefore, two-lane operations, namely USB 3.2 Gen 1×2 (10 Gbit/s) and Gen 2×2 (20 Gbit/s), are only possible with Full-Featured USB-C. As of 2023, they are somewhat rarely implemented; Intel, however, started to include them in its 11th-generation SoC processor models, but Apple never provided them.
The USB Power Delivery specification revision 2.0 (USB PD Rev. 2.0) has been released as part of the USB 3.1 suite. [ 58 ] [ 65 ] [ 66 ] It covers the USB-C cable and connector with a separate configuration channel, which now hosts a DC coupled low-frequency BMC -coded data channel that reduces the possibilities for RF interference . [ 67 ]
eSATAp throughput is not necessarily the same as SATA, many enclosures and docks that support both eSATA and USB use combo bridge chips which can severely reduce the throughput, and USB throughput is that of the USB version supported by the port (typically USB 3.0 or 2.0). eSATAp ports (bracket versions [clarification needed]) can run at a ...
USB 2.0 Billboard Device Class Specification USB 2.0 Billboard Device Class is defined to communicate the details of supported Alternate Modes to the computer host OS. It provides user readable strings with product description and user support information. Billboard messages can be used to identify incompatible connections made by users.
The xHCI reduces the need for periodic device polling by allowing a USB 3.0 or later device to notify the host controller when it has data available to read, and moves the management of polling USB 2.0 and 1.1 devices that use interrupt transactions from the CPU-driven USB driver to the USB host controller.
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