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This technique is preferred because the vessels are too small to be picked up by an artery forceps. Large vessels, if present, can be under-run with suture. When the dural tear is associated with a dural sinus hemorrhage, a graft of pericranium is used for a small tear and a muscle graft from temporalis is used for a large tear. The muscle ...
Duralumin (also called duraluminum, duraluminium, duralum, dural(l)ium, or dural) is a trade name for one of the earliest types of age-hardenable aluminium–copper alloys. The term is a combination of Düren and aluminium .
The etiology of dural ectasia is unknown, but it has been suggested that is due to increased hydrostatic pressure, [8] general weakened connective tissue [9] or as a result of the pulsatile flow of cerebrospinal fluid on weakened spinal dura. [10] Dural ectasia is common in Marfan syndrome, [3] occurring in 63–92% of people with the syndrome ...
Dural punctures usually present with a headache or backache within 3 days of the procedure. [13] The headache causes pain over the forehead and the back of the head. A distinguishing feature between PDPH and other types of headaches is the exacerbation of the headache with standing, and is non-throbbing like the common tension headaches. [ 13 ]
The dura mater covering the spinal cord is known as the dural sac or thecal sac, and only has one layer (the meningeal layer) unlike cranial dura mater. The potential space between these two layers is known as the epidural space , [ 5 ] which can accumulate blood in the case of traumatic laceration to the meningeal arteries .
Styrofoam insulation extruded polystyrene foam (XPS), owned and manufactured by DuPont. Styrofoam is a genericized trademarked brand of closed-cell extruded polystyrene foam (XPS), manufactured to provide continuous building insulation board used in walls, roofs, and foundations as thermal insulation and as a water barrier.
Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...
The most important technical challenges in the implementation of a successful composite patch repair are: (a) proper design of the repair patch and the procedures that will be followed, (b) selection of the most suitable materials and tools for the application, (c) careful surface preparation, (d) implementation of the composite patch repair ...