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A related term sealing current (aka wetting current or fritting current) is widely used in the telecommunication industry describing a small constant DC current (typically 1-20 mA) in copper wire loops in order to avoid contact oxidation of contacts and splices.
When the contact is operating under power (wet), the sources of the wear are the result of high current densities in microscopic areas, and the electric arc. [2] Contact wear includes material transfer between contacts, loss of contact material due to splattering and evaporation, and oxidation or corrosion of the contacts due to high ...
The result is a rapidly pulsed electric current instead of a clean transition from zero to full current. The effect is usually unimportant in power circuits, but causes problems in some analogue and logic circuits that respond fast enough to misinterpret the on‑off pulses as a data stream. [5]
When relay contacts open to interrupt a high current with an inductive load, a voltage spike will result, striking an arc across the contacts. If the voltage is high enough, an arc may be struck even without an inductive load. Regardless of how the arc forms, it will persist until the current through the arc falls to the point too low to ...
The use of a "fluid transistor" in microfluidic circuits for manipulating chemical and biological fluids was first investigated by J. Brown in 1980 and later funded in 1984–1988 under NSF Grants 8760730 & 8822197, [4] employing insulating dielectric and hydrophobic layer(s) (EWOD), immiscible fluids, DC or RF power; and mass arrays of ...
An inrush current limiter is a device or devices combination used to limit inrush current. Passive resistive components such as resistors (with power dissipation drawback), or negative temperature coefficient (NTC) thermistors are simple options while the positive one (PTC) is used to limit max current afterward as the circuit has been operating (with cool-down time drawback on both).
Illustration of the "reference directions" of the current (), voltage (), and power () variables used in the passive sign convention.If positive current is defined as flowing into the device terminal which is defined to be positive voltage, then positive power (big arrow) given by the equation = represents electric power flowing into the device, and negative power represents power flowing out.
In the assembly of integrated circuit packages to printed circuit boards, a head-in-pillow defect (HIP or HNP), also called ball-and-socket, [1] is a failure of the soldering process. For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may ...