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A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
Defense-Independent Component ERA (DICE) is a 21st-century variation on Component ERA, one of an increasing number of baseball sabermetrics that fall under the umbrella of defense independent pitching statistics. DICE was created by Clay Dreslough in 2001. [1] The formula for Defense-Independent Component ERA (DICE) is:
To blow a pitch ("by" a batter) is to throw one so fast the batter is unable to keep up (with it). To blow a save is to lose a lead or the game after coming into the game in a "save situation". This has a technical meaning in baseball statistics. A hit, typically a home run: "Ortiz's Blow Seals Win."
What is a cutter? A dart. Hitting the fairway on a dogleg hole. The slider-fastball midpoint. What does it look like? A cutter is a fastball with a hint of a slider’s bite.
Baseball statistics include a variety of metrics used to evaluate player and team performance in the sport of baseball. Because the flow of a baseball game has natural breaks to it, and player activity is characteristically distinguishable individually, the sport lends itself to easy record-keeping and compiling statistics .
Quality of Pitch (QOP) is a theoretical pitch quantification statistic combines speed, location and movement into a single numeric value that quantifies the quality of a baseball pitch. QOP was developed by Jarvis Greiner and Jason Wilson of Biola University , California, as a method of objectively evaluating pitches in baseball . [ 1 ]
Pitch quantification is the attempt to describe the quality of a pitch using a single numeric value based on quantifiable aspects of an individual baseball pitch. There are two main kinds of pitch quantification.
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.