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Physics-based modeling of devices, in distributed and lumped forms, is an essential part of the IC process development. It seeks to quantify the underlying understanding of the technology and abstract that knowledge to the device design level, including extraction of the key parameters [4] that support circuit design and statistical metrology.
Electronic design automation (EDA), also referred to as electronic computer-aided design (ECAD), [1] is a category of software tools for designing electronic systems such as integrated circuits and printed circuit boards. The tools work together in a design flow that chip designers use to design and analyze entire semiconductor chips.
Design flows are the explicit combination of electronic design automation tools to accomplish the design of an integrated circuit. Moore's law has driven the entire IC implementation RTL to GDSII design flows [clarification needed] from one which uses primarily stand-alone synthesis, placement, and routing algorithms to an integrated construction and analysis flows for design closure.
This causes front-end development to be a costly and inefficient process, where manual coding is the predominant development approach, reuse of design artifacts is low, and portability of applications across platforms remains difficult. IFML brings several benefits to the development of application front-ends:
A process design kit (PDK) is a set of files used within the semiconductor industry to model a fabrication process for the design tools used to design an integrated circuit. The PDK is created by the foundry defining a certain technology variation for their processes. It is then passed to their customers to use in the design process.
A process flow diagram (PFD) is a diagram commonly used in chemical and process engineering to indicate the general flow of plant processes and equipment. The PFD displays the relationship between major equipment of a plant facility and does not show minor details such as piping details and designations.
Gate array design is a manufacturing method in which diffused layers, each consisting of transistors and other active devices, are predefined and electronics wafers containing such devices are "held in stock" or unconnected prior to the metallization stage of the fabrication process. The physical design process defines the interconnections of ...
These devices and technology were the basis of the first integrated circuits; nonetheless, many of the scaling issues and underlying physical effects are integral to IC design, even after four decades of IC development. With these early generations of IC, process variability and parametric yield were an issue—a theme that will reemerge as a ...