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DDR3 triple-channel architecture is used in the Intel Core i7-900 series (the Intel Core i7-800 series only support up to dual-channel). The LGA 1366 platform (e.g. Intel X58) supports DDR3 triple-channel, normally 1333 and 1600Mhz, but can run at higher clock speeds on certain motherboards.
The DDR3L (DDR3 Low Voltage) standard is an addendum to the JESD79-3 DDR3 Memory Device Standard specifying low voltage devices. [31] The DDR3L standard is 1.35 V and has the label PC3L for its modules. Examples include DDR3L‐800 (PC3L-6400), DDR3L‐1066 (PC3L-8500), DDR3L‐1333 (PC3L-10600), and DDR3L‐1600 (PC3L-12800).
The DDR3 JEDEC standard for VLP DIMM height is around 0.740 inches (18.8 mm). These will fit vertically in ATCA systems. Full-height 240-pin DDR2 and DDR3 DIMMs are all specified at a height of around 1.18 inches (30 mm) by standards set by JEDEC. These form factors include 240-pin DIMM, SO-DIMM, Mini-DIMM and Micro-DIMM. [16]
Two types of DIMMs (dual in-line memory modules): a 168-pin SDRAM module (top) and a 184-pin DDR SDRAM module (bottom). Memory modules of SK Hynix. In computing, a memory module or RAM stick is a printed circuit board on which memory integrated circuits are mounted.
An A790GXH motherboard that can support AM2, AM2+ and AM3 socket CPUs. Some motherboard manufacturers (e.g. ASRock, Jetway, and MSI) have released hybrid motherboards that are equipped with an AM2+ socket and both DDR2 and DDR3 memory slots. These boards permit the use of AM2/AM2+ processors with DDR2 RAM, or AM3 processors with either DDR2 or ...
DDR3 advances extended the ability to preserve internal clock rates while providing higher effective transfer rates by again doubling the prefetch depth. The DDR4 SDRAM is a high-speed dynamic random-access memory internally configured as 16 banks, 4 bank groups with 4 banks for each bank group for ×4/×8 and 8 banks, 2 bank groups with 4 ...
VIA chipsets support CPUs from Intel, AMD (e.g. the Athlon 64) and VIA themselves (e.g. the VIA C3 or C7).They support CPUs as old as the i386 in the early 1990s. In the early 2000s, their chipsets began to offer on-chip graphics support from VIA's joint venture with S3 Graphics beginning in 2001; this support continued into the early 2010s, with the release of the VX11H in August 2012.
The sole principal change from AM2+ to AM3 is support for DDR3 SDRAM. The fastest CPU for socket AM3 is the Phenom II X6 1100T . Like the previous AMD socket, the "AM3 Processor Functional Data Sheet" (AMD document number 40778) has not been made publicly available.
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