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2. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   The amount of time solder paste can stay on a stencil without affecting its printing properties. The paste manufacturer provides this value. Tack Tack is the property of a solder paste to hold a component after the component had been placed by the placement machine. Hence, tack life is the critical property of solder pastes.

3. Ball grid array - Wikipedia

   en.wikipedia.org/wiki/Ball_grid_array

   A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.

4. Tin-silver-copper - Wikipedia

   en.wikipedia.org/wiki/Tin-silver-copper

   Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]

5. Land grid array - Wikipedia

   en.wikipedia.org/wiki/Land_grid_array

   The land grid array is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. [2]

6. Solder alloys - Wikipedia

   en.wikipedia.org/wiki/Solder_alloys

   Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ...

7. Solder - Wikipedia

   en.wikipedia.org/wiki/Solder

   In contrast to using traditional bars or coiled wires of all-metal solder and manually applying flux to the parts being joined, much hand soldering since the mid-20th century has used flux-core solder. This is manufactured as a coiled wire of solder, with one or more continuous bodies of inorganic acid or rosin flux embedded lengthwise inside it.