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CTBGA: thin chip array ball grid array; CVBGA: very thin chip array ball grid array; DSBGA: die-size ball grid array; FBGA: fine ball grid array based on ball grid array technology. It has thinner contacts and is mainly used in system-on-a-chip designs; also known as fine pitch ball grid array (JEDEC-Standard [9]) or fine line BGA by Altera.
Closeup of the pins of a pin grid array The pin grid array at the bottom of prototype Motorola 68020 microprocessor The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket. A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are ...
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...
The substrate can have a Ball Grid Array (BGA) on its underside. The substrate makes the connections to the die available for use by the PCB. [ 11 ] Substates made with build up film such as Ajinomoto Build up Film (ABF), are manufactured around a core, and the film is stacked on the core in layers by vacuum lamination at high temperatures.
They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory.
The next big innovation was the area array package, which places the interconnection terminals throughout the surface area of the package, providing a greater number of connections than previous package types where only the outer perimeter is used. The first area array package was a ceramic pin grid array package. [1]
80-pin ceramic quad flat package (TQFP) – ST6 microcontroller The basic form is a flat rectangular (often square) body with leads on four sides but with numerous variation in the design. These differ usually only in lead number, pitch, dimensions, and materials used (usually to improve thermal characteristics).
SOIC-16 A PIC microcontroller (wide SOIC-28) in a ZIF socket. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less.
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