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In electronics, a cross section, cross-section, or microsection, is a prepared electronics sample that allows analysis at a plane that cuts through the sample.It is a destructive technique requiring that a portion of the sample be cut or ground away to expose the internal plane for analysis.
A mass haul diagram where land and rock cuts are hauled to fills Fill construction in 1909 Cut & Fill Software showing cut areas highlighted in red and fill areas shaded in blue. In earthmoving , cut and fill is the process of constructing a railway , road or canal whereby the amount of material from cuts roughly matches the amount of fill ...
This winding method reaches the highest fill factor and is the best way to fill the available winding cross-section with round wires. Square coils are seen as orthocyclically wound when the winding and layer jump occur only on one of the sides of the winding cross-section. In theory, a geometric fill factor of 0.91 will be reached.
Soil nails were used to stabilize an 18 metres (59 ft) high slope consisting of sandy soil. This method proved to be more cost-effective, while at the same time cut down the construction time when compared to other conventional support methods. [4]: 23 Germany was the next country to investigate soil nailing.
Here the advantages sought can include minimizing tool movement that is not producing product, or maximizing how many pieces can be fabricated in one build session. One difference from nesting of cut pieces is that 3D parts often have a cross section that changes with height, which can cause interference between adjacent parts as they are built up.
The divisional round of the playoffs is up next. NFL divisional round schedule, playoff bracket: Chiefs, Lions back in action after postseason bye week
A son who held his parent's alleged murderer at gunpoint is opening up about his final moments with his mother and father. T.D. Gribble recalled how he embraced his mom Paula, 76, and kissed the ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.