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HP Imprint Design: Radiance imprint finish; Operating System: Windows Vista Home Premium (32-bit) Dimensions (inches): 13.15 length x 9.33 width x 1.54 maximum closed height; Weight: approximately 5.29 lb (2.40 kg) Accessories: remote control, 65 watt AC power adapter Dock/Base: The HP xb3000 Notebook Expansion Base was designed for use with ...
The HP Pavilion dv7 was a model series of laptops manufactured by Hewlett-Packard Company from 2008 to 2012 that featured 16:10 17.0" or 16:9 17.3" diagonal displays. It was produced concurrently with the HP Pavilion dv4 and the HP Pavilion dv5 series, featuring 14.1" and 15.4" displays respectively.
Memory modules of SK Hynix. In computing, a memory module or RAM stick is a printed circuit board on which memory integrated circuits are mounted. [1] Memory modules permit easy installation and replacement in electronic systems, especially computers such as personal computers, workstations, and servers. The first memory modules were ...
The lower memory clock frequency may also enable power reductions in applications that do not require the highest available data rates. According to JEDEC [ 5 ] the maximum recommended voltage is 1.9 volts and should be considered the absolute maximum when memory stability is an issue (such as in servers or other mission critical devices).
A DIMM (Dual In-Line Memory Module) is a popular type of memory module used in computers. It is a printed circuit board with one or both sides (front and back) holding DRAM chips and pins . [ 1 ] The vast majority of DIMMs are manufactured in compliance with JEDEC memory standards , although there are proprietary DIMMs.
HP Pavilion: dv7 (17"), dv6 (15+"), dv5 (15"), dv2 (12") series The HP Pavilion dv4 is a model series of laptops manufactured by Hewlett-Packard Company that features a 14.1" diagonal display. The HP Pavilion dv5 features a 15.4" and the HP Pavilion dv7 a 17" display.
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HP Imprint was a high-gloss finish for laptop and notebook computers developed by Nissha Printing Co. of Japan in cooperation with HP. It was first developed in May 2006 alongside a new line of HP Pavilion laptops, using an advanced molding technique commonly used in several products such as mobile phone cases, interiors for luxury automobiles ...