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  2. 2 nm process - Wikipedia

    en.wikipedia.org/wiki/2_nm_process

    In semiconductor manufacturing, the 2 nm process is the next MOSFET (metal–oxide–semiconductor field-effect transistor) die shrink after the 3 nm process node.. The term "2 nanometer", or alternatively "20 angstrom" (a term used by Intel), has no relation to any actual physical feature (such as gate length, metal pitch or gate pitch) of the transistors.

  3. Transistor count - Wikipedia

    en.wikipedia.org/wiki/Transistor_count

    The transistor count is the number of transistors in an electronic device (typically on a single substrate or silicon die).It is the most common measure of integrated circuit complexity (although the majority of transistors in modern microprocessors are contained in cache memories, which consist mostly of the same memory cell circuits replicated many times).

  4. List of semiconductor scale examples - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    Apple A12 and Huawei Kirin 980 mobile processors, both released in 2018, use 7 nm chips manufactured by TSMC. [127] AMD began using TSMC 7 nm starting with the Vega 20 GPU in November 2018, [128] with Zen 2-based CPUs and APUs from July 2019, [129] and for both PlayStation 5 [130] and Xbox Series X/S [131] consoles' APUs, released both in ...

  5. TSMC's FinFET Density Claim Seems Questionable - AOL

    www.aol.com/2014/01/27/tsmcs-finfet-density...

    When Intel gave its "analyst day" presentation on Nov. 21, 2013, Intel showed a chart that confirmed the company means pretty serious business in both transistor leadership and metal stack density ...

  6. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    Additionally, TSMC and Samsung's 10 nm processes are only slightly denser than Intel's 14 nm in transistor density. They are actually much closer to Intel's 14 nm process than they are to Intel's 10 nm process (e.g. Samsung's 10 nm processes' fin pitch is the exact same as that of Intel's 14 nm process: 42 nm).

  7. TSMC - Wikipedia

    en.wikipedia.org/wiki/TSMC

    TSMC's N7+ is the first commercially available extreme-ultraviolet lithographic process in the semiconductor industry. [101] It uses ultraviolet patterning and enables more acute circuits to be implemented on the silicon. N7+ offers a 15–20 percent higher transistor density and 10 percent reduction in power consumption than previous technology.

  8. Mentor Graphics Provides Design, Verification, Thermal and ...

    www.aol.com/2012/10/15/mentor-graphics-provides...

    Mentor Graphics Provides Design, Verification, Thermal and Test Solutions for TSMC's CoWoS™ Reference Flow WILSONVILLE, Ore.--(BUSINESS WIRE)-- Mentor Graphics Corp. (NAS: MENT) today announced ...

  9. Moore's law - Wikipedia

    en.wikipedia.org/wiki/Moore's_law

    As of 2022, the commercially available processor possessing one of the highest numbers of transistors is an AD102 graphics processor with more than 76,3 billion transistors. [139] Density at minimum cost per transistor – This is the formulation given in Moore's 1965 paper. [1]