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  2. Thermal expansion - Wikipedia

    en.wikipedia.org/wiki/Thermal_expansion

    A number of materials contract on heating within certain temperature ranges; this is usually called negative thermal expansion, rather than "thermal contraction".For example, the coefficient of thermal expansion of water drops to zero as it is cooled to 3.983 °C (39.169 °F) and then becomes negative below this temperature; this means that water has a maximum density at this temperature, and ...

  3. Ultra low expansion glass - Wikipedia

    en.wikipedia.org/wiki/Ultra_low_expansion_glass

    Ultra low expansion glass has an coefficient of thermal expansion of about 10 −8 /K at 5–35 °C. [2] It has a thermal conductivity of 1.31 W/(m·°C), thermal diffusion of 0.0079 cm 2 /s, a mean specific heat of 767 J/(kg·°C), a strain point of 890 °C [1634 °F], and an estimated softening point of 1490 °C [2714 °F], an annealing point ...

  4. Borosilicate glass - Wikipedia

    en.wikipedia.org/wiki/Borosilicate_glass

    Guitar slide made of borosilicate glass. Borosilicate glass is a type of glass with silica and boron trioxide as the main glass-forming constituents. Borosilicate glasses are known for having very low coefficients of thermal expansion (≈3 × 10 −6 K −1 at 20 °C), making them more resistant to thermal shock than any other common glass.

  5. Thermomechanical analysis - Wikipedia

    en.wikipedia.org/wiki/Thermomechanical_analysis

    Increased thermal vibrations produce thermal expansion characterized by the coefficient of thermal expansion (CTE) that is the gradient of the graph of dimensional change versus temperature. CTE depends upon thermal transitions such as the glass transition. CTE of the glassy state is low, while at the glass transition temperature (Tg) increased ...

  6. Glass frit bonding - Wikipedia

    en.wikipedia.org/wiki/Glass_frit_bonding

    Further, the coefficient of thermal expansion (CTE) of the glass material is adapted to silicon. This results in low stress in the bonded wafer pair. The glass has to flow and wet the soldered surfaces well below the temperature where deformation or degradation of either of the joined materials or nearby structures (e.g., metallization layers ...

  7. Thermal expansivities of the elements - Wikipedia

    en.wikipedia.org/wiki/Thermal_expansivities_of...

    (Top) 1 Thermal expansion. 2 Notes. 3 References. Toggle References subsection. 3.1 CRC. 3.2 CR2. 3.3 LNG. 3.4 WEL. Toggle the table of contents. Thermal ...

  8. Thermal shock - Wikipedia

    en.wikipedia.org/wiki/Thermal_shock

    Thermal shock resistance measures can be used for material selection in applications subject to rapid temperature changes. The maximum temperature jump, , sustainable by a material can be defined for strength-controlled models by: [4] [3] = where is the failure stress (which can be yield or fracture stress), is the coefficient of thermal expansion, is the Young's modulus, and is a constant ...

  9. Visions (cookware) - Wikipedia

    en.wikipedia.org/wiki/Visions_(cookware)

    Visions is a brand of transparent stove top cookware created by Corning France and introduced to Europe during the late 1970s. In 1983, it was introduced in the United States and became the number one selling cookware set for a number of years. Visions is made of a transparent material belonging to the Pyroceram family of glass-ceramics. It is ...