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[4] As an alternative, many circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting. [5] Conformal coating gives most of the benefits of potting, and is lighter and easier to inspect, test, and repair. Conformal coatings can be applied as liquid or condensed from a vapor phase.
A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.
Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common.
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, [1] and may or may not cover the entire underside of the package.
Drawing of a tape-automated bonding carrier and definitions of various parts of the TAB assembly. Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILEX) film carrier.
A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...
In "wire bonding", the chip is attached to the board with an adhesive. Each pad on the device is connected with a fine wire lead that is welded to the pad and to the circuit board. This is similar to the way that an integrated circuit is connected to its lead frame, but instead the chip is wire-bonded directly to the circuit board. [3]
[3] The die is glued or soldered to the die pad inside the lead frame, and then bond wires are attached between the die and the bond pads to connect the die to the leads in a process called wire bonding. In a process called encapsulation, a plastic case is moulded around the lead frame and die, exposing only the leads.
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