Search results
Results from the WOW.Com Content Network
The 65 nm process is an advanced lithographic node used in volume CMOS semiconductor fabrication. Printed linewidths (i.e. transistor gate lengths) can reach as low as 25 nm on a nominally 65 nm process, while the pitch between two lines may be greater than 130 nm.
The technology used a 32 nm SOI process, two CPU cores per module, and up to four modules, ranging from a quad-core design costing approximately US$130 to a $280 eight-core design. Ambarella Inc. announced the availability of the A7L system-on-a-chip circuit for digital still cameras, providing 1080p60 high-definition video capabilities in ...
In CPU fabrications, a die shrink always involves an advance to a lithographic node as defined by ITRS (see list). For GPU and SoC manufacturing, the die shrink often involves shrinking the die on a node not defined by the ITRS, for instance, the 150 nm, 110 nm, 80 nm, 55 nm, 40 nm and more currently 8 nm nodes, sometimes referred to as "half-nodes".
reengineered P6-based microarchitecture used in Intel Core 2 and Xeon microprocessors, built on a 65 nm process, supporting x86-64 level SSE instruction and macro-op fusion and enhanced micro-op fusion with a wider front end and decoder, larger out-of-order core and renamed register, support loop stream detector and large shadow register file.
POWER6 can connect to up to 31 other processors using two inter node links (50 GB/s), and supports up to 10 logical partitions per core (up to a limit of 254 per system). There is an interface to a service processor that monitors and adjusts performance and power according to set parameters.
Process variation is the naturally occurring variation in the attributes of transistors (length, widths, oxide thickness) when integrated circuits are fabricated.The amount of process variation becomes particularly pronounced at smaller process nodes (<65 nm) as the variation becomes a larger percentage of the full length or width of the device and as feature sizes approach the fundamental ...
The brand's first processor, codenamed Smithfield and manufactured on the 90 nm process, was released on May 25, 2005, followed by the 65 nm Presler nine months later. [3] The core implementation on the 90 nm Smithfield and later 65 nm Presler are designed differently but are functionally the same.
These techniques have enabled photolithography at the 32 nanometer CMOS process technology node using a wavelength of 193 nm (deep ultraviolet). However, with the ITRS roadmap calling for the 22 nanometer node to be in use by 2011, photolithography researchers have had to develop an additional suite of improvements to make 22 nm technology ...