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A chip scale atomic clock (CSAC) is a compact, low-power atomic clock fabricated using techniques of microelectromechanical systems (MEMS) and incorporating a low-power semiconductor laser as the light source. The first CSAC physics package was demonstrated at the National Institute of Standards and Technology in 2003, [1] based on an invention ...
Products included hydrogen masers, rubidium and cesium atomic standards, temperature and oven controlled crystal oscillators, miniature and chip scale atomic clocks, network time servers, network sync management systems, cable timekeeping solutions, telecom synchronization supply units (SSUs), and timing test sets.
Toshiba TLCS-12, a microprocessor developed for the Ford EEC (Electronic Engine Control) system in 1973. [11] Intel 8080 CPU launched in 1974 was manufactured using this process. [96] The Television Interface Adaptor, the custom graphics and audio chip developed for the Atari 2600 in 1977. [97]
In August 2004, NIST scientists demonstrated a chip-scale atomic clock that was 100 times smaller than an ordinary atomic clock and had a much smaller power consumption of 125 mW. [ 33 ] [ 34 ] The atomic clock was about the size of a grain of rice with a frequency of about 9 GHz.
Bare silicon chip, an early chip-scale package CSP: Chip-scale package: Package size is no more than 1.2× the size of the silicon chip [16] [17] TCSP: True chip-size package: Package is same size as silicon [18] TDSP: True die-size package: Same as TCSP [18] WCSP or WL-CSP or WLCSP: Wafer-level chip-scale package
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The atomic scale thickness of graphene provides a pathway for accelerometers to be scaled down from micro to nanoscale while retaining the system's required sensitivity levels. [ 35 ] By suspending a silicon proof mass on a double-layer graphene ribbon, a nanoscale spring-mass and piezoresistive transducer can be made with the capability of ...
Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. [1] Flat no-lead packages usually, but not always, include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB).